Ke alakaʻi nei i ka mea hoʻolako ʻo Rigid PCB Boards
ʻO nā PCB koʻikoʻi maʻamau a hana i nā ʻano hoʻonohonoho like ʻole mai ka papa hoʻokahi a i ka multilayer.Ma muli o ke ʻano o ka hoʻolako ʻana i ka PCB, hiki i ka PCB ShinTech ke hāʻawi i ka papa inoa nui o nā ʻenehana e hōʻoiaʻiʻo pono ana i kā mākou mea kūʻai waiwai i nā hopena koʻikoʻi ma kahi kumu hoʻokahi, ma mua o ka hele ʻana mai kahi hale kūʻai papa i kahi hale kūʻai papa.Hāʻawi ʻo PCB ShinTech i nā papa paʻa e like me kāu kikoʻī o ka papahana a me nā koi kūikawā.Me ka nui o nā mea hiki, nā mea a me nā hoʻonohonoho, hiki i kāu mau papa kaapuni paʻi paʻi paʻi ke hana ma nā wahi he nui me ka paʻa mau.
ʻO ka hoʻohui ʻana i nā makahiki o ka ʻike me nā mea hou loa i ka hana ʻenehana kiʻekiʻe e ʻae i ka uku ʻana o PCB ShinTech i waena o nā mea hoʻokūkū.Hana ʻia kā mākou papa kaapuni i paʻi ʻia ma muli o nā alakaʻi IPC a hoʻokō me ISO9001, UL, TS16949a me nā kūlana RoHS.Kāhea iā mā˚ou"
Inclusive
● Huli wikiwiki, Nui Prototype, Nui Hana
● A hiki i 50 papa
● 2mil/50µm tracks, annular apo
● 6 mil/150µm ka nui wili mīkini liʻiliʻi
● 4 mil/100µm ka nui wili laser liʻiliʻi
● UL, ISO9001, TS16949 a me RoHS i hōʻoia ʻia
● Impedance hoʻomalu ʻia ±5%
●15:1 Max.ʻAspect Ratio
● Makapō / Kanu ʻia / Micro Vias
● Via In Pad me nā koho hoʻopiha
● Mea wela kiʻekiʻe, alapine kiʻekiʻe
● Aluminum a me nā mea'ē aʻe / kūikawā
● Hoʻohui Kiʻekiʻe Kiʻekiʻe (HDI)
● Mānoanoa keleawe kiʻekiʻe
● E-Hoʻāʻo
● AOI a me X-Ray no ka multilayer
● Papa IPC II, Papa III
● Hoʻokō RoHS
Noonoo Mea
ʻO nā mea i hoʻohana ʻia i kāu PCB e pili ana i nā kikoʻī o kāu papahana.ʻO ka mea maʻamau lākou e komo pū me:
CONDUCTOR - ʻO ke kumu metala a mākou e hoʻohana ai e hilinaʻi i kāu mau kikoʻī a me nā pono conductivity, e like me ka alumini, i hoʻohana ʻia no ka conductivity thermal kiʻekiʻe.
ADHESIVES - E ʻokoʻa kāu mea hoʻopili e pili ana i kāu mau kikoʻī papahana a me ka mānoanoa conductor.ʻO nā koho: Epoxy., Prepreg., Acrylic., etc..
INSULATORS - E hāʻawi mākou i kahi insulator e hāʻawi i ka hoʻoili hōʻailona ikaika a me ka palekana.Aia nā mea hiki ke loaʻa:
● Nā uhi uhi, nā uhi uhi a me ka uhi uhi solder.
● Mea maʻamau FR-4.
● Lead-free kūpono FR-4 mea.
E like me ke ʻano maʻamau no nā PCB ʻoʻoleʻa, hoʻohana nā papa FR-4 i kahi papa fiberglass pale ahi no ka ʻoi aku o ka rigidity a me ka pale ʻana i ke ahi.ʻO kēia mau papa he māmā a me ka mahana- a me ka makū-kūʻai, e lilo lākou i koho maikaʻi loa no nā noi he nui.
Ke hana nā PCB i nā wela kiʻekiʻe, loaʻa i nā papa kaapuni kiʻekiʻe-Tg kahi mahana hoʻololi aniani (Tg) ma luna o 150 degere Celsius.Inā 'oe e hana ana me ka mana ki'eki'e kaapuni mānoanoa ho'olālā, wela i hana 'ia e hiki ke ho'opololei i ka ma'amau o ka PCB hooponopono wela.ʻO nā papa High-Tg ka hopena kūpono i kēia mau hiʻohiʻona.
Hoʻopau i ka ʻili
E hoʻohana kāu PCB paʻa i kahi ʻāpana keleawe no ka holo ʻana o ka uila a pono e pale i ka corrosion a me ka oxidation.ʻO nā hoʻopau palekana hiki ke loaʻa:
● Electroless nickel immersion gula (ENIG).
● Electroless nickel electroless palladium immersion gula (ENEPIG).
● ipu kaiapuni.
● Ea wela solder leveling (HASL).
● kālā kaiapuni.
● HASL me ke alakaʻi ʻole.
● gula electrolytic uea-bondable.
●Nā manamana gula paʻakikī.
E hoʻouna i kāu nīnau a i ʻole noi ʻōlelo iā mākou masales@pcbshintech.come hoʻopili i kekahi o kā mākou mau mea kūʻai aku i loaʻa ka ʻike ʻoihana e kōkua iā ʻoe e loaʻa i kou manaʻo i ka mākeke.
