Nūhou

Pehea e koho ai i ka Surface Finish no kāu PCB Design

---He alakaʻi alakaʻi no ka PCB Surface Finishs

Ⅰ He aha a pehea

Hoʻouna ʻia:Nov15, 2022

Māhele: Blogs

Nā huaʻōlelo: pcb,pcba,hui pcb,mea hana pcb, hana pcb

I ka wā e pili ana i ka hoʻopau ʻana i ka ʻili, aia nā koho like ʻole, e laʻa me HASL, OSP, ENIG, ENEPIG, Gula Paʻa, ISn, IAg, a pēlā aku. gula;ʻOi aku ka maikaʻi o ka HASL a i ʻole HASL-free no ka hoʻokomo ʻana i nā mea SMT nui.Eia naʻe, paʻakikī paha ke koho ʻana i hoʻokahi hoʻopau no ʻoe nā papa HDI me Ball Grid Arrays (BGAs) inā ʻaʻohe ʻike ʻē aʻe.Aia kekahi mau mea e like me kāu kālā no kēia papahana, pono e noʻonoʻo ʻia nā koi no ka hilinaʻi a i ʻole nā palena o ka manawa hana ma kekahi mau kūlana.ʻO kēlā me kēia ʻano o ka PCB ili hoʻopau i kona mau pono a me nā pōʻino, hiki ke huikau i nā mea hoʻolālā PCB e hoʻoholo i ka mea kūpono no kāu mau papa PCB.Aia mākou ma ʻaneʻi e kōkua iā ʻoe e noʻonoʻo iā lākou me kā mākou mau makahiki he nui ma ke ʻano he mea hana.

1. He aha ka PCB ili pau

ʻO ka noi ʻana i ka hoʻopau ʻana i ka ʻili (ka mālama ʻana i ka ʻili / ka uhi ʻana o ka ʻili) kekahi o nā ʻanuʻu hope loa o ka hana ʻana i nā PCB.ʻO ka hoʻopau ʻana i ka ʻili he mea koʻikoʻi ma waena o kahi papa PCB ʻole a me nā ʻāpana, e lawelawe ana no nā kumu koʻikoʻi ʻelua, e hāʻawi i kahi ʻāpana solderable no ka hui PCB a me ka pale ʻana i ke koena keleawe i hōʻike ʻia me nā ʻāpana, nā pads, nā lua a me nā mokulele honua mai ka oxidation a i ʻole contamination. ʻoiai ke uhi nei ka mask solder i ka hapa nui o ka circuitry.

He mea koʻikoʻi ka hoʻopau ʻana o ka ʻili no ka hana PCB PCB ShinTech.No ka hoʻolako ʻana i kahi ʻāpana solderable no ka hui ʻana o ka PCB a me ka pale ʻana i ke keleawe i ʻike ʻia mai ka oxidation a me ka contamination.

ʻAʻole kepau ʻole ka hoʻopau ʻana o ka ʻili o kēia wā, e like me ka Restriction of Hazardous Substances (RoHS) a me Waste Electrical and Electronic Equipment (WEEE) kuhikuhi.ʻO nā koho hoʻopau ʻili PCB o kēia manawa he:

● LF-HASL (Lead Free Hot Air Solder Leveling)
● OSP (Organic Solderability Preservatives)
● ENIG (Electroless Nickel Immersion Gold)
● ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
● Electrolytic Nickel/Gold - Ni/Au (Gold/Soft Gold)
● Kālā Immersion, IAg
●Tin Keʻokeʻo a i ʻole Immersion Tin, ISn

2. Pehea e koho ai i ka pau ʻana o ka ʻili no kāu PCB

ʻO kēlā me kēia ʻano o ka PCB ili hoʻopau i kona mau pono a me nā pōʻino, hiki ke huikau i nā mea hoʻolālā PCB e hoʻoholo i ka mea kūpono no kāu mau papa PCB.Ke koho ʻana i ka mea kūpono no kāu hoʻolālā, pono e noʻonoʻo i nā kumu he nui e like me kēia.

★ Budge
★ Nā papa kaapuni kaiapuni noi hope loa (no ka laʻana ka wela, ka haʻalulu, RF).
★ Nā koi no ka mea noi manuahi Lead, pili i ke kaiapuni.
★ Pono pono no ka papa PCB.
★ ʻAno ʻāpana, ʻano nui a i ʻole nā koi no ka hui ʻana e laʻa me ka paʻi paʻi, SMT, ka hoʻopaʻa uea, Ke kūʻai ʻana ma loko o ka lua, etc.
★ Nā koi no ka palahalaha o ka ʻili o nā pā SMT no ka noi BGA.
★ Nā koi no ke ola ʻana a me ka hana hou ʻana o ka pau ʻana o ka ʻili.
★ Ke kū'ē kū'ē / hāʻule.No ka laʻana, ʻaʻole kūpono ʻo ENIG no ke kelepona paʻakikī no ka mea pono ke kelepona akamai i nā paʻa tin-copper no ka haʻalulu kiʻekiʻe a hāʻule i ke kūpaʻa ma mua o nā paʻa tin-nickel.
★ Ka nui a me ke kahe ana.No ka nui o nā PCB, hiki ke lilo ka pahu immersion i mau koho hilinaʻi a ʻoi aku ka maikaʻi ma mua o ka ENIG a me ka Immersion Silver a hiki ke pale ʻia nā pilikia tarnish sensitivity.ʻOi aku ka maikaʻi o ke kālā kaiapuni ma mua o ka ISn ma kahi puʻupuʻu liʻiliʻi.
★ Pilikia i ka ʻinoʻino a i ʻole ka ʻinoʻino.No ka laʻana, ʻoi aku ka maikaʻi o ka hoʻopau ʻana i ke kālā immersion i ka corrosion.Pilikia ka OSP a me ka Immersion tin i ka lawelawe ʻana i nā pōʻino.
★ Nā mea nani o ka papa, etc.

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Ka manawa hoʻouna: Nov-15-2022