Pehea e koho ai i ka Surface Finish no kāu PCB Design
Ⅱ Ka Loiloi a me ka Hoʻohālikelike
Nui nā ʻōlelo aʻoaʻo e pili ana i ka pau ʻana o ka ʻili, e like me ke alakaʻi-free HASL pilikia ka loaʻa ʻana o ka palahalaha mau.He pipiʻi maoli ka Electrolytic Ni/Au a inā he nui ke gula i waiho ʻia ma luna o ka pā, hiki ke alakaʻi i nā hui solder brittle.Immersion tin i solderability degradation ma hope o ka 'ike 'ana i ka nui wela pōʻaiapuni, e like me ka luna a me kaʻaoʻao PCBA reflow kaʻina, etc.Hōʻike ka papa ma lalo i kahi loiloi koʻikoʻi no ka hoʻopau ʻana i ka ʻili o nā papa kaapuni i paʻi ʻia.
Papa 1 He wehewehe pōkole o ke kaʻina hana, nā mea maikaʻi a me nā pōʻino, a me nā noi maʻamau o ka hoʻopau ʻia ʻana o ke alakaʻi kaulana o PCB.
| Hoʻopau ʻili PCB | Kaʻina hana | mānoanoa | Nā pono | Nā pōʻino | Nā noi maʻamau |
| HASL kepau-ole | Hoʻokomo ʻia nā papa PCB i loko o ka ʻauʻau ʻauʻau i hoʻoheheʻe ʻia a puhi ʻia e nā pahi ea wela no ka paʻi ʻana a me ka wehe ʻana i ka solder. | 30µin(1µm) -1500µin(40µm) | Maikaʻi Solderability;Loaʻa nui;Hiki ke hoʻoponopono / hana hou;Paʻa lōʻihi lōʻihi | Nā ʻili like ʻole;Haʻalulu wela;ʻino ka pulu;Alahaka kūʻai;Nā PTH i hoʻopili ʻia. | Pili nui;He kūpono no nā pads nui a me ka spacing;ʻAʻole kūpono no HDI me <20 mil (0.5mm) pitch maikaʻi a me BGA;ʻAʻole maikaʻi no PTH;ʻAʻole kūpono no ka PCB keleawe mānoanoa;ʻO ka mea maʻamau, noi: Nā papa kaapuni no ka hoʻāʻo ʻana i ka uila, ka hao lima, kekahi mau mea uila hana kiʻekiʻe e like me ka aerospace a me nā mea kaua. |
| OSP | Ke hoʻohana kemika i ka mea hoʻohuihui i ka ʻili o nā papa e hana ana i kahi ʻāpana metala organik e pale aku i ke keleawe puka mai ka ʻōpala. | 46µin (1.15µm)-52µin(1.3µm) | Kumukuai haahaa;ʻAʻahu a palahalaha nā Pads;Solderability maikaʻi;Hiki ke hui pū me nā hoʻopau ʻili ʻē aʻe;He maʻalahi ke kaʻina hana;Hiki ke hana hou (i loko o ka hale hana). | Pilikino i ka lawelawe ʻana;Pōkole ola mālama.He palena iki ka laha ana o solder;Hoʻohaʻahaʻa solderability me ke kiʻekiʻe temp & pōʻaiapuni;Nonconductive;Paʻakikī i ka nānā ʻana, ICT probe, ionic & press-fit concerns | Pili nui;Kūpono maikaʻi no nā SMT / pitches maikaʻi / BGA / mea liʻiliʻi;E lawelawe i nā papa;ʻAʻole maikaʻi no nā PTH;ʻAʻole kūpono no ka ʻenehana crimping |
| ENIG | He kaʻina hana kemika e hoʻopaʻa ana i ke keleawe i hōʻike ʻia me ka Nickel a me ke gula, no laila he papa ʻelua o ka uhi metala. | 2µin (0.05µm)– 5µin (0.125µm) o ke gula ma luna o 120µin (3µm)– 240µin (6µm) o Nickel | Solderability maikaʻi loa;He palahalaha a like ole na Pads;Al uea liʻiliʻi;Kūleʻa pili haʻahaʻa;Noho lōʻihi;Kūleʻa maikaʻi i ka corrosion a me ka lōʻihi | "Black Pad" hopohopo;ʻO ka poho hōʻailona no nā noi pono hōʻailona;hiki ole ke hana hou | Maikaʻi no ka hui ʻana o ka pitch maikaʻi a me ka hoʻokomo ʻana o ka mauna ʻili (BGA, QFP…);Maikaʻi no nā ʻano Soldering lehulehu;Pono no ka PTH, kaomi pono;Wire Bondable;Manaʻo no ka PCB me ka noi hilinaʻi kiʻekiʻe e like me aerospace, pūʻali koa, lāʻau lapaʻau a me nā mea kūʻai kiʻekiʻe kiʻekiʻe, etc.;ʻAʻole ʻōlelo ʻia no ka Touch Contact Pads. |
| Electrolytic Ni/Au (Ke gula palupalu) | 99.99% maʻemaʻe - 24 carat Gold i hoʻopili ʻia ma luna o ka papa nickel ma o ke kaʻina electrolytic ma mua o ka soldermask. | 99.99% gula maʻemaʻe, 24 Karat 30µin (0.8µm) -50µin (1.3µm) ma luna o 100µin (2.5µm) -200µin (5µm) o Nickel | ʻili paʻa paʻa;Nui ka conductivity;Palahalaha;Al uea liʻiliʻi;Kūleʻa pili haʻahaʻa;Ola lōʻihi | Pipiʻi;Au embrittlement ina manoanoa;Nā palena hoʻolālā;ʻO ka hana ʻoi aku ka nui o ka hana;ʻAʻole kūpono no ke kūʻai ʻana;ʻAʻole like ka uhi ʻana | Hoʻohana nui ʻia i ka uea (Al & Au) hoʻopaʻa i loko o ka puʻupuʻu chip e like me COB (Chip on Board) |
| Electrolytic Ni/Au (Gula paʻa) | 98% maʻemaʻe - 23 carat gula me nā mea paʻakikī i hoʻohui ʻia i ka ʻauʻau plating i hoʻopili ʻia ma luna o ka papa nickel ma o ka hana electrolytic. | 98% gula maʻemaʻe, 23 Karat30µin(0.8µm) -50µin(1.3µm) ma luna o 100µin(2.5µm) -150µin(4µm) o Nickel | Solderability maikaʻi loa;He palahalaha a like ole na Pads;Al uea liʻiliʻi;Kūleʻa pili haʻahaʻa;Hiki ke hana hou | ʻO ka ʻinoʻino (ka mālama ʻana a me ka mālama ʻana) i loko o ke kaiapuni sulfur kiʻekiʻe;Hoʻemi i nā koho kaulahao hoʻolako e kākoʻo i kēia hoʻopau;ʻO ka puka makani hana pōkole ma waena o nā pae hui. | Hoʻohana nui ʻia no ka hoʻopili uila e like me nā mea hoʻopili lihi (manamana gula), nā papa lawe IC (PBGA/FCBGA/FCCSP...), nā kīʻaha, nā kelepona pākaukau a me kekahi mau papa hoʻāʻo, etc. |
| Kaiapuni Ag | waiho ʻia kahi ʻāpana kālā ma ka ʻili keleawe ma o ke kaʻina hana hoʻoheheʻe electroless ma hope o ka etch akā ma mua o ka soldermask | 5µin(0.12µm) -20µin(0.5µm) | Solderability maikaʻi loa;He palahalaha a like ole na Pads;Al uea liʻiliʻi;Kūleʻa pili haʻahaʻa;Hiki ke hana hou | ʻO ka ʻinoʻino (ka mālama ʻana a me ka mālama ʻana) i loko o ke kaiapuni sulfur kiʻekiʻe;Hoʻemi i nā koho kaulahao hoʻolako e kākoʻo i kēia hoʻopau;ʻO ka puka makani hana pōkole ma waena o nā pae hui. | ʻO ka ʻokoʻa koʻikoʻi i ka ENIG no nā Traces maikaʻi a me BGA;Kūpono no ka noi ʻana i nā hōʻailona wikiwiki;Maikaʻi no nā hoʻololi membrane, pale EMI, a me ka hoʻopaʻa ʻana i ka uea alumini;He kūpono no ka paʻi paʻi. |
| Immersion Sn | I loko o kahi ʻauʻau ʻauʻau electroless, waiho pololei kahi ʻāpana keʻokeʻo keʻokeʻo o Tin ma ke keleawe o nā papa kaapuni i mea pale no ka pale ʻana i ka oxidation. | 25µin (0.7µm)-60µin (1.5µm) | ʻOi loa no ka ʻenehana paʻi kūpono;Kūʻai-pono;Planar;ʻOi loa ka solderability (ke hou) a me ka hilinaʻi;Palahalaha | ʻO ka hoʻohaʻahaʻa solderability me nā manawa kiʻekiʻe a me nā pōʻai;Hiki ke ʻinoʻino ka pahu i hōʻike ʻia ma ka hui hope;Hoʻoponopono i nā pilikia;Tin Wiskering;ʻAʻole kūpono no PTH;Loaʻa iā Thiourea, kahi Carcinogen kaulana. | Manaʻo no nā huahana nui;Maikaʻi no ka hoʻokomo SMD, BGA;ʻOi aku ka maikaʻi no ka press fit a me nā mokulele hope;ʻAʻole ʻōlelo ʻia no ka PTH, nā hoʻololi pili, a me ka hoʻohana ʻana me nā masks peelable |
Papa 2 He loiloi o nā waiwai maʻamau o PCB Surface Finishs hou ma ka hana a me ka noi
| Iecaianoaaiiuo o ka loa hoʻohana 'ilikai pau | |||||||||
| Waiwai | ENIG | ENEPIG | Gula palupalu | Gula paʻa | IAg | ʻO ISn | HASL | HASL- LF | OSP |
| Kaulana | Kiʻekiʻe | Haʻahaʻa | Haʻahaʻa | Haʻahaʻa | Kauwaena | Haʻahaʻa | Haʻahaʻa | Kiʻekiʻe | Kauwaena |
| Uku Kaʻina Hana | Kiʻekiʻe (1.3x) | Kiʻekiʻe (2.5x) | Kiʻekiʻe loa (3.5x) | Kiʻekiʻe loa (3.5x) | Kauwaena (1.1x) | Kauwaena (1.1x) | Haʻahaʻa (1.0x) | Haʻahaʻa (1.0x) | Haʻahaʻa loa (0.8x) |
| Waihona | Kaiapuni | Kaiapuni | Electrolytic | Electrolytic | Kaiapuni | Kaiapuni | Kaiapuni | Kaiapuni | Kaiapuni |
| Ola Pahu | lōʻihi | lōʻihi | lōʻihi | lōʻihi | Kauwaena | Kauwaena | lōʻihi | lōʻihi | Pōkole |
| Hoʻokō RoHS | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | No | ʻAe | ʻAe |
| ʻO ka hui like ʻana o ka ʻili no SMT | Maikaʻi | Maikaʻi | Maikaʻi | Maikaʻi | Maikaʻi | Maikaʻi | ʻilihune | Maikaʻi loa | Maikaʻi |
| Ke keleawe i wehe ʻia | No | No | No | ʻAe | No | No | No | No | ʻAe |
| Ka lawelawe ʻana | Maʻamau | Maʻamau | Maʻamau | Maʻamau | koʻikoʻi | koʻikoʻi | Maʻamau | Maʻamau | koʻikoʻi |
| Ka Hana Hana | Kauwaena | Kauwaena | Kiʻekiʻe | Kiʻekiʻe | Kauwaena | Kauwaena | Kauwaena | Kauwaena | Haʻahaʻa |
| Kaha hana hou | No | No | No | No | ʻAe | ʻAʻole ʻōlelo ʻia | ʻAe | ʻAe | ʻAe |
| Pono ʻia nā pōʻai wela | lehulehu | lehulehu | lehulehu | lehulehu | lehulehu | 2-3 | lehulehu | lehulehu | 2 |
| Pilikia Whisker | No | No | No | No | No | ʻAe | No | No | No |
| Puka wela (PCB MFG) | Haʻahaʻa | Haʻahaʻa | Haʻahaʻa | Haʻahaʻa | Haahaa Loa | Haahaa Loa | Kiʻekiʻe | Kiʻekiʻe | Haahaa Loa |
| Kū'ē haʻahaʻa / kiʻekiʻe kiʻekiʻe | No | No | No | No | ʻAe | No | No | No | N/A |
| ʻO nā noi o ka hoʻohana maʻamau i hoʻopau ʻia | |||||||||
| Nā noi | ENIG | ENEPIG | Gula palupalu | Gula paakiki | IAg | ʻO ISn | HASL | LF-HASL | OSP |
| ʻoʻoleʻa | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe |
| Flex | Kāohi ʻia | Kāohi ʻia | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe |
| Flex-Rigid | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAʻole makemake ʻia |
| Pitch maikaʻi | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAʻole makemake ʻia | ʻAʻole makemake ʻia | ʻAe |
| BGA & μBGA | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAʻole makemake ʻia | ʻAʻole makemake ʻia | ʻAe |
| Hoʻohuihui lehulehu | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | Kāohi ʻia |
| Hoʻopeʻe Chip | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | No | No | ʻAe |
| Kaomi iā Fit | Kāohi ʻia | Kāohi ʻia | Kāohi ʻia | Kāohi ʻia | ʻAe | Maikaʻi | ʻAe | ʻAe | Kāohi ʻia |
| Ma-Hole | ʻAe | ʻAe | ʻAe | ʻAe | ʻAe | No | No | No | No |
| Hoʻopaʻa Uea | ʻAe (Al) | ʻAe (Al, Au) | ʻAe (Al, Au) | ʻAe (Al) | Hoʻololi (Al) | No | No | No | ʻAe (Al) |
| Māmā Māmā | Maikaʻi loa | Maikaʻi loa | Maikaʻi loa | Maikaʻi loa | Maikaʻi loa | Maikaʻi loa | ʻilihune | ʻilihune | Maikaʻi loa |
| Kūʻai Kūʻai Kūʻai | Maikaʻi loa | Maikaʻi loa | ʻilihune | ʻilihune | Maikaʻi | Maikaʻi loa | Maikaʻi loa | Maikaʻi loa | Maikaʻi loa |
He mea koʻikoʻi ka mālama ola ʻana i ka wā e hana ai i kāu papa hana.Ola PahuʻO ia ka puka makani hana e hāʻawi i ka hoʻopau ʻana i kahi weldability PCB piha.He mea nui ia e hōʻoia i ka hui ʻana o kāu mau PCB āpau i loko o ke ola o ka papa.Ma waho aʻe o nā mea a me nā kaʻina hana e hoʻopau ai i ka ʻili, hoʻoikaika nui ʻia ke ola o ka hoʻopau ʻanae nā PCB hoʻopili a mālama.ʻO ka mea noi i ke ʻano mālama mālama kūpono i ʻōlelo ʻia e nā alakaʻi IPC-1601 e mālama i ka weldability a me ka hilinaʻi o ka pau ʻana.
Papa 3 Hoʻohālikelike i ke ola o ka papa ma waena o nā ʻili kaulana o PCB
|
| OLA SHEL maʻamau | Manaʻo Paʻa Ola | Manawa hana hou |
| HASL-LF | 12 mahina | 12 mahina | ʻAE |
| OSP | 3 mahina | 1 mahina | ʻAE |
| ENIG | 12 mahina | 6 mahina | ʻAʻOLE* |
| ENEPIG | 6 mahina | 6 mahina | ʻAʻOLE* |
| Electrolytic Ni/Au | 12 mahina | 12 mahina | NO |
| IAg | 6 mahina | 3 mahina | ʻAE |
| ʻO ISn | 6 mahina | 3 mahina | ʻAE** |
* No ka ENIG a me ENEPIG e hoʻopau ana i kahi pōʻai hoʻāla hou e hoʻomaikaʻi i ka pulu o ka ʻili a loaʻa ke ola o ka papa.
** ʻAʻole i manaʻo ʻia ka hana hou ʻana o ka Chemical Tin.
Ke kuai Blogs
Ka manawa hoʻouna: Nov-16-2022
